Перегляд за Автор "Zatovska, N. P."

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    SOLDER FOR FORMATION OF CONTACTS TO CONVERTERS OF OPTICAL AND X-RAY IMAGES INTO THE ELECTRICAL SIGNAL
    (Одеський національний університет імені І. І. Мечникова, 2018) Lavrenova, T. I.; Borshchak, Vitalii A.; Zatovska, N. P.; Kutalova, Mariia I.; Лавренова, Т. И.; Борщак, Виталий Анатольевич; Затовская, Наталия Петровна; Куталова, Мария Ивановна; Лавренова, Т. І.; Борщак, Віталій Анатолійович; Затовська, Наталія Петрівна; Куталова, Марія Іванівна
    The pasty solder is used in the technology of the installation of electro-radio elements. Such elements can be microcircuits and optical and X-ray images microelectronic sensors with a hard raster [1]. Tinning of such sensor contact surfaces and printed circuit boards, where such sensors are mounted and soldering of the sensors to the plate is a considerable problem due to the need to remove corrosive active paste radical. The advantage of the developed solder is low corrosion activity and high fluxing ability. After soldering, there is no need to clean the surface of the printed circuit board and the contact sensor from paste redicals and chemical reaction products.