Lepikh, Yaroslav I.Lavrenova, T. I.2019-02-192019-02-192018X International Conf. “Topical Problems of Semiconductor Physics” (Truskavets, Ukraine, June 26-29, 2018.). - Truskavets, 2018.https://dspace.onu.edu.ua/handle/123456789/21877Functional basis of materials (pastes) for thick-film elements of hybrid integrated circuits and sensors are, as a rule, metal-oxide compounds of ruthenium, silver, palladium and gold and also oxides, carbides, boruides, nitrides, silicides of the other metals. Nanocomposite elements based on the "glass - metal compounds" are formed by the annealing of the pastes which are composed of a mix of superfine powders of a glass and a functional material which disperse in special organic binding agent.ennanocomposite elementsHIC and sensorsglass matrixNanocomposite elements for HIC and sensors with a fusible glass matrixArticle